Radium Technology focuses on the research and development, production and sales of integrated circuit chips and Microsystems. Its products and technologies are widely used in wireless communication terminals and other fields.
Radium Technology related integrated circuit technology From 2018 to 2020 (report period), the net cash flow generated by operating activities was -1.0816 million yuan, 12.7283 million yuan and 11.0886 million yuan, respectively, and the proportion of R&D investment in operating income was 407.44%, 41.9% and 19.92%, respectively.
Radium technology focuses on the research and development, production and sales of integrated circuit chips and microsystems, and provides technical services around related products. The company’s main products include terminal RF front-end chips, RF transceiver chips and high-speed and high-precision ADC/DAC, power management chips, microsystems and modules, etc.,
Providing customers with chips and microsystem products and technical solutions from antenna to signal processing. The company’s products and technologies are widely used in wireless communication terminals, communication radar systems, electronic system power supply and distribution, and gradually expand to mobile communication systems, satellite Internet and other fields.
Main business includes two types of chip products and technical services. Technical services are mainly carried out around the above-mentioned main business products according to the needs of customers. During the reporting period, the company’s products were mainly used in wireless communication terminals and communication radar systems.
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The product model development of many affiliated enterprises and scientific research institutes of military industrial groups, and related products have been applied to major equipment models in many countries. The terminal RF front-end chip developed by the company has been applied to integrated terminals, Beidou navigation terminals and new generation radio stations; RF transceiver chips have been applied to high-speed frequency hopping data chains and digital phased array radars; power management chips have been applied to low-orbit communication satellite area protection, early warning, space target monitoring radar; microsystems and modules It is used in communication satellites and airborne loads.
According to the announcement, according to the valuation level of comparable listed companies in the same industry and the current transaction market value of the issuer, the market value is expected to be not less than 1 billion yuan, the net profit in the last year is positive and the operating income is not less than 100 million yuan. According to the listing conditions stipulated in the Shanghai Stock Exchange Science and Technology Innovation Board Stock Listing Rules, the company meets the listing conditions that the estimated market value is not less than 1 billion yuan, the net profit in the latest year is positive and the operating income is not less than 100 million yuan.
After deducting the issuance fee, the raised funds will be invested in the R&D and industrialization project of RF microsystems, R&D and industrialization projects of programmable RF signal processing chips, R&D and industrialization projects of solid-state electronic switches, headquarters bases and cutting-edge technology R&D projects, and replenish liquidity. The total investment of the raised funds investment project is 704.5826 million yuan.
The fund-raising investment Radium Technology project is carried out around the main business, focusing on improving the company’s technical research and development strength, which is an upgrade, extension and supplement to the existing business, and will not lead to changes in the company’s production and operation model. Relying on the existing management level and technology accumulation, the company will further improve its management and R&D capabilities through fund-raising investment projects, and improve and upgrade the existing product lines such as terminal RF front-end chips, RF transceiver chips, high-speed and high-precision ADC/DAC chips, power management chips, microsystems and modules.
Grade, further improve the competitiveness and popularity of the company’s Radium Technology products, and achieve stable growth of operating income and net profit scale. Among them, the RF microsystem research and development and industrialization project is expected to be built for three years, with a total investment of 12.6529 million yuan, of which 38.4 million yuan is for equipment purchase, 71.46565 million yuan for research and development, 2.201 million yuan for basic preparation, and 14.2815 million yuan for laying working capital.
If the downstream military industry customers’ demand for terminal RF front-end chips, RF transceiver chips, high-speed and high-precision ADC/DAC, power management chips, microsystems and modules and other products change, and the company is unable to expand new customers or businesses in time, it will adversely affect the company’s business performance. .